SEMICONDUCTOR PROCESS SHEET

• Main Authors: SATO KEI, SHIGA GOSHI
• Format: Patent
• Language: English; Japanese
• Published: 24.06.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a semiconductor process sheet suitable for efficiently manufacturing semiconductor packages in which the movement and warping of semiconductor chips are suppressed.SOLUTION: The semiconductor process sheet X has a double-sided adhesive sheet 10 and a thermosetting resin layer 20. The double-sided adhesive sheet 10 includes a base material 11, a reduced adhesion adhesive layer 12, and for example, a pressure-sensitive adhesive layer 13, in a laminated structure between its adhesive surfaces 10a and 10b. The thermosetting resin layer 20 is peelably adhered to the adhesive side 10b of the double-sided adhesive sheet 10, for example. In the semiconductor process sheet X, the glass transition temperature of the thermosetting resin layer 20 is above the molding temperature of the semiconductor device encapsulant or above 120°C.SELECTED DRAWING: Figure 1 【課題】半導体チップの移動及び反りが抑制された半導体パッケージを効率よく製造するのに適した半導体プロセスシートを提供する。【解決手段】半導体プロセスシートＸは両面粘着シート１０と熱硬化性樹脂層２０を備える。両面粘着シート１０は、その粘着面１０ａ及び１０ｂ間の積層構造中に基材１１、粘着力低減型の粘着剤層１２、及び、例えば感圧性の粘着剤層１３を含む。熱硬化性樹脂層２０は両面粘着シート１０の例えば粘着面１０ｂ上に剥離可能に密着している。半導体プロセスシートＸでは、熱硬化性樹脂層２０のガラス転移温度が、半導体素子封止材の成形温度以上又は１２０℃以上である。【選択図】図１