SEMICONDUCTOR MODULE

• Main Authors: NANBA AKIHIRO, SENOO MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 17.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor module in which an insulation board for insulating between a high voltage part such as power supply wiring and a low voltage part such as signal wiring is insulated, capable of downsizing while keeping insulation resistance inside the module.SOLUTION: A semiconductor module includes: a power semiconductor element; a drain conductor connected to a drain terminal of the power semiconductor element; a source conductor connected to a source terminal of the power semiconductor element, and disposed opposing to the drain conductor with sandwiching the power semiconductor element; an insulation board disposed between the drain conductor and the source conductor; and a mounting component disposed on the insulation board. The mounting component is disposed at the source conductor side of the insulation board with a distance from the source conductor.SELECTED DRAWING: Figure 3 【課題】電源配線などの高電圧部と信号配線などの低電圧部とを絶縁する絶縁基板を内蔵した半導体モジュールにおいて、モジュール内部の絶縁耐性を維持しつつ、小型化が可能な半導体モジュールを提供する。【解決手段】パワー半導体素子と、前記パワー半導体素子のドレイン端子に接続されるドレイン導体と、前記パワー半導体素子のソース端子に接続され、前記パワー半導体素子を挟んで前記ドレイン導体に対向して配置されるソース導体と、前記ドレイン導体と前記ソース導体の間に配置される絶縁基板と、前記絶縁基板上に配置される実装部品と、を備え、前記実装部品は、前記ソース導体から間隔を有して、前記絶縁基板の前記ソース導体側に配置されることを特徴とする。【選択図】 図３