ENCAPSULATING COMPOSITION

• Main Author: TOYAMA SHIGEKI
• Format: Patent
• Language: English; Japanese
• Published: 17.06.2021
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an encapsulating composition which can maintain a high-adhesive force between adhered bodies even if it is used for the encapsulation of a hollow structure to be processed at a high temperature and has a high-humidity resistance.SOLUTION: An encapsulating composition of the present invention, contains: a (meth) acryl oligomer having (a-1): a bisphenol skeleton; and a (meth) acryl monomer having (a-2): a hydroxyl group, and contains (A): a radical curable resin, (B): a light radical polymerization initiator, and (C): a filler material (where a fumed silica is excluded) having at least one of the (a-1) component and the (a-2) component includes an acryloyl group.SELECTED DRAWING: None 【課題】高温処理する中空構造体の封止に用いられても、被着体間の高い接着力を維持できるとともに、耐湿性の高い封止用組成物を提供する。【解決手段】本発明の封止用組成物は、（ａ−１）：ビスフェノール骨格を有する（メタ）アクリルオリゴマー、及び（ａ−２）：水酸基を有する（メタ）アクリルモノマー、を含み、（ａ−１）成分及び（ａ−２）成分の少なくとも一方はアクリロイル基を有する、（Ａ）：ラジカル硬化性樹脂、（Ｂ）：光ラジカル重合開始剤、並びに（Ｃ）：充填剤（但し、ヒュームドシリカを除く）を含む。【選択図】なし