EPOXY RESIN AND EPOXY RESIN COMPOSITION

• Main Authors: NAKANISHI MASATAKA, IMAI TAKASHI, KAWANO YUSUKE, ITAI MASAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 17.06.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide an epoxy resin high in the compatibility with a thermoplastic resin and excellent in the mechanical strength and low water absorption, an epoxy resin composition and its cured material.SOLUTION: A dicyclopentadiene type epoxy resin represented by the following formula (1), in which, in a HPLC measurement, a compound of n=1 is contained in the range of 1 to 20 area% in a total amount of the epoxy resin. (In the formula (1), n represents 1≤n≤20.)SELECTED DRAWING: None 【課題】熱可塑性樹脂との相溶性が高く、機械強度、低吸水性に優れるエポキシ樹脂、エポキシ樹脂組成物及びその硬化物の提供。【解決手段】下記式（１）で表されるジシクロペンタジエン型エポキシ樹脂であって、ＨＰＬＣ測定において、ｎ＝１の化合物をエポキシ樹脂総量中１〜２０面積％含有するエポキシ樹脂。（式（１）中、ｎは、１≦ｎ≦２０を表す。）【選択図】なし