DICING/DIE BONDING INTEGRATED FILM AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: MORI SHUICHI, KIMURA HISAHIRO, TAZAWA TSUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 27.05.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a dicing/die bonding integrated film which enables sufficient width of a calf to be ensured even when a narrow blade is used. and a manufacturing method thereof.SOLUTION: A film 10 comprises: a substrate layer 1; a pressure-sensitive adhesive layer 3 made of an active energy ray-curable adhesive having a first surface F1 facing the substrate layer 1 and a second surface F2 on the opposite side thereof; and an adhesive layer 5 provided so as to cover the central portion of the second surface F2. The active energy ray-curable adhesive includes a (meth) acrylic resin having a chain-polymerizable functional group, and the functional group is at least one selected from an acryloyl group and a methacryloyl group, and the content of the functional group in the (meth) acrylic resin is 0.4 mmol/g or more.SELECTED DRAWING: Figure 1 【課題】幅の狭いブレードを用いた場合であっても、カーフの幅を充分に確保することが可能なダイシング・ダイボンディング一体型フィルム及びその製造方法を提供すること。【解決手段】フィルム１０は、基材層１と、基材層１と対面する第１の面Ｆ１及びその反対側の第２の面Ｆ２を有する、活性エネルギー線硬化型粘着剤からなる粘着剤層３と、第２の面Ｆ２の中央部を覆うように設けられた接着剤層５とを備える。活性エネルギー線硬化型粘着剤は、連鎖重合可能な官能基を有する（メタ）アクリル系樹脂を含み、官能基は、アクリロイル基及びメタクリロイル基から選ばれる少なくとも１種であり、（メタ）アクリル系樹脂における官能基の含有量は、０．４ｍｍｏｌ／ｇ以上である。【選択図】図１