ULTRASONIC TREATMENT APPARATUS AND ULTRASONIC TREATMENT METHOD

To further equalize surface treatment by more surely spreading ultrasonic waves to a plurality of treatment objects when applying surface treatment to the plurality of treatment objects all together.SOLUTION: An ultrasonic treatment apparatus in the present invention includes: a treatment tank for s...

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Main Authors DATE HIROMITSU, HOSHIBA ERI, TOKUMARU SHINJI
Format Patent
LanguageEnglish
Japanese
Published 27.05.2021
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Summary:To further equalize surface treatment by more surely spreading ultrasonic waves to a plurality of treatment objects when applying surface treatment to the plurality of treatment objects all together.SOLUTION: An ultrasonic treatment apparatus in the present invention includes: a treatment tank for storing a treatment liquid to apply prescribed surface treatment to treatment objects, and immersing the treatment objects; and an ultrasonic oscillating body provided inside an aggregate comprising a plurality of treatment objects immersed in the treatment liquid, and applying ultrasonic waves to the treatment liquid. The ultrasonic oscillating body has a hollow member extending in a prescribed axial direction, and an ultrasonic waves applying mechanism held in a hollow part of the hollow member, and penetrates ultrasonic waves oscillated from the ultrasonic waves applying mechanism into the outside of the hollow member. The ultrasonic oscillating body is brought into contact with at least two treatment objects. When a size of a cross section of the treatment object is a[mm], and a size of a cross section of the hollow member is D[mm], a ratio (D/a) of the sizes of the cross sections satisfies a relation of 0.2≤D/a≤6.0.SELECTED DRAWING: Figure 1B 【課題】複数の処理対象物をまとめて表面処理を施す際に、複数の処理対象物に対してより確実に超音波を伝播させて、表面処理のより一層の均一化を図ること。【解決手段】本発明の超音波処理装置は、処理対象物に対して所定の表面処理を施す処理液を収容し、処理対象物が浸漬される処理槽と、処理液に浸漬される複数の処理対象物からなる集合体の内部に設けられるものであり、処理液に対して超音波を印加する超音波発振体とを備え、超音波発振体は、所定の軸方向に延伸する中空部材と、中空部材の中空部に保持された超音波印加機構とを有しており、超音波印加機構から発振された超音波を中空部材の外部に透過させるものであり、超音波発振体は、少なくとも2つの処理対象物と接触しており、処理対象物の断面の大きさをa[mm]とし、中空部材の断面の大きさをD[mm]としたときに、断面の大きさの比(D/a)は、0.2≦D/a≦6.0の関係を満足する。【選択図】図1B
Bibliography:Application Number: JP20190207936