COPPER-CLAD LAMINATE

To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a...

Full description

Saved in:
Bibliographic Details
Main Authors ORITA TAKAHIRO, IWASAKO YASUSHI, UENO SUKETSUGU
Format Patent
LanguageEnglish
Japanese
Published 20.05.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:To provide a copper-clad laminate capable of achieving both heat dissipation and withstand voltage.SOLUTION: A copper-clad laminate includes a copper layer 1, an insulating layer 2 and a substrate 4 in this order. The insulating layer 2 has a structure in which an inorganic filler is dispersed in a matrix of a silicone resin in which methyl groups and ethyl groups account for 80% or more of a total functional groups, and the insulating layer 2 is directly bonded to the copper layer 1 and the substrate 4.SELECTED DRAWING: Figure 3 【課題】放熱性と耐電圧とを両立させることのできる銅張積層板を提供する。【解決手段】銅層１、絶縁層２および基板４をこの順に有し、絶縁層２は、メチル基およびエチル基が全体の官能基のうち８０％以上を占めるシリコーンレジンのマトリックス中に無機フィラーが分散した組織を有し、絶縁層２が銅層１と基板４にそれぞれ直接接合されている、銅張積層板。【選択図】図３
Bibliography:Application Number: JP20190201665