PROCESSING QUALITY PREDICTION SYSTEM

• Main Authors: MORITA HIROSHI, YONEZU HISAHIRO, ISHIGURE YUKI, SAEKI YUYA, SHIBATA HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 20.05.2021
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

To provide a processing quality prediction system that can predict a state of an affected layer generated in a work-piece, with higher accuracy.SOLUTION: A processing quality prediction system 1 comprises: a grinder main body 11 that performs grinding processing to a work-piece W with a grinding wheel T; a detector 13d that detects observable state data in the grinder main body 11 during grinding processing of the work-piece W; and a prediction part 73 that predicts a state of an affected layer using the state data detected by the detector 13d. The detector 13d includes a heat flow sensor that detects as the state data heat radiation data obtained from a position different from a grinding point Pa on a surface of at least either of the grinding wheel T and the work-piece W.SELECTED DRAWING: Figure 4 【課題】工作物に生成された加工変質層の状態をより高精度に予測することができる加工品質予測システムを提供する。【解決手段】加工品質予測システム１は、砥石車Ｔにより工作物Ｗの研削加工を行う研削盤本体１１と、工作物Ｗの研削加工中に研削盤本体１１における観測可能な状態データを検出する検出器１３ｄと、検出器１３ｄにより検出された状態データを用いて加工変質層の状態を予測する予測部７３とを備える。検出器１３ｄは、砥石車Ｔ及び工作物Ｗの少なくとも一方の表面において研削点Ｐａとは異なる位置からの放熱データを状態データとして検出する熱流センサを含む。【選択図】図４