COMPOSITION FOR BUFFER SHEET, AND BUFFER SHEET

• Main Authors: SUZUKI NAOYA, ONOZEKI HITOSHI, TAKAHASHI HIROSHI, FUJIMOTO DAISUKE, KOSEKI YUTA, YAMADA KUNPEI
• Format: Patent
• Language: English; Japanese
• Published: 13.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide: a buffer sheet which can suppress the displacement of an electronic component and a substrate, and which is to be used suitably when manufacturing a plurality of electronic component devices collectively; and a composition for a buffer sheet, which is used in manufacturing the buffer sheet.SOLUTION: A composition for a buffer sheet comprises a thermosetting compound. The composition is used for manufacturing a buffer sheet which is to be interposed between a member for heating and the electronic component when heating, by the member for heating, the electronic component to mount the electronic component on a substrate.SELECTED DRAWING: Figure 1A 【課題】電子部品と基板との位置ずれを抑制することが可能であり、且つ、複数個の電子部品装置を一括して製造する際に好適に用いられる緩衝シート、及びその緩衝シートの製造に用いられる緩衝シート用組成物を提供する。【解決手段】熱硬化性化合物を含有し、加熱用部材により電子部品を加熱して前記電子部品を基板に実装する際に、前記加熱用部材と前記電子部品との間に介在される緩衝シートを製造するために用いられる緩衝シート用組成物【選択図】図１Ａ