ADHESIVE TAPE

To provide an adhesive tape containing a thermal-expansible microsphere and excellent in detachability after heating, with less residual glue on an adherend.SOLUTION: An adhesive tape includes a substrate and an adhesive layer arranged at least on one side of the substrate. The adhesive layer includ...

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Bibliographic Details
Main Authors KAWANISHI MICHIO, NISHIO AKINORI, HIRAYAMA TAKAMASA
Format Patent
LanguageEnglish
Japanese
Published 13.05.2021
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Summary:To provide an adhesive tape containing a thermal-expansible microsphere and excellent in detachability after heating, with less residual glue on an adherend.SOLUTION: An adhesive tape includes a substrate and an adhesive layer arranged at least on one side of the substrate. The adhesive layer includes a thermal-expansible microsphere. If the adhesive tape is heated at a heating rate of 3°C/min. by a thermomechanical analysis, time required from a point A to a point B is 45-200 sec., when the point A is a deformation start point, a point C is a point where a deformation amount of the adhesive tape becomes maximum after passing the point A and expanding, and the point B is a point where a deformation amount becomes half the amount of the point C, on a way from the point A to the point C.SELECTED DRAWING: Figure 1 【課題】熱膨張性微小球を含んで加熱後の剥離性に優れ、かつ、被着体への糊残りが少ない粘着テープを提供すること。【解決手段】本発明の粘着テープは、基材と、該基材の少なくとも一方の面に配置された粘着剤層とを備える粘着テープであって、該粘着剤層が、熱膨張性微小球を含み、該粘着テープを熱機械分析において、加熱速度3℃/分で加熱した際、変形開始点をA点とし、該A点経過後膨張して該粘着テープの変形量が最大となる点をC点とし、A点からC点に至るまでの間で変形量がC点における変形量の半分となる点をB点としたとき、A点からB点に至るまでの時間が、45秒〜200秒である。【選択図】図1
Bibliography:Application Number: JP20210019687