RESIN COMPOSITION AND POLYIMIDE RESIN FILM

• Main Authors: UEDA ATSUSHI, ARAKAWA YUMIKO, OE TADAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 13.05.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a resin composition excellent in heat resistance and toughness and capable of forming a polyimide resin film, and to provide a polyimide resin film using the same.SOLUTION: The resin composition contains (a) a polyimide precursor and (b) an organic solvent. The polyimide precursor (a) is...