RESIN COMPOSITION AND POLYIMIDE RESIN FILM

• Main Authors: UEDA ATSUSHI, ARAKAWA YUMIKO, OE TADAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 13.05.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a resin composition excellent in heat resistance and toughness and capable of forming a polyimide resin film, and to provide a polyimide resin film using the same.SOLUTION: The resin composition contains (a) a polyimide precursor and (b) an organic solvent. The polyimide precursor (a) is a polyamic acid having structural units of the following formulae (1)-(4): (1) -(NH-R1-NH)-; (2) -(CO-R2(C00H)2-CO)-; (3) -(NH-R3-NH)-; and (4) -(CO-R4(C00H)2-CO)-. The content of the structural unit of the formula (1) is 50.0-99.9 mol% based on the total of the structural units of the formula (1) and the formula (3). The content of the structural unit of the formula (2) is 15 mol% or more based on the total of the structural units of the formula (2) and the formula (4).SELECTED DRAWING: None 【課題】耐熱性及び靱性に優れ、且つポリイミド樹脂膜の形成が可能な樹脂組成物、及びこれを用いたポリイミド樹脂膜を提供する。【解決手段】（ａ）ポリイミド前駆体と、（ｂ）有機溶剤とを含む樹脂組成物であって、（ａ）ポリイミド前駆体が、下記式（１）〜（４）の構造単位を有するポリアミド酸であり、式（１）及び式（３）の構造単位の合計に対し、式（１）の構造単位が５０．０モル％〜９９．９モル％であり、式（２）及び式（４）の構造単位の合計に対し、式（２）の構造単位が１５モル％以上である樹脂組成物。（１）−（ＮＨ-Ｒ１−ＮＨ）−（２）−（ＣＯ−Ｒ２（Ｃ００Ｈ）２−ＣＯ）−（３）−（ＮＨ-Ｒ３−ＮＨ）−（４）−（ＣＯ−Ｒ４（Ｃ００Ｈ）２−ＣＯ）−【選択図】なし