METHOD FOR PROCESSING RESIN SUBSTRATE

• Main Author: UMEDA YOSHIO
• Format: Patent
• Language: English; Japanese
• Published: 06.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; POLISHING; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a method for processing a resin substrate, capable of fixing the resin substrate to a chuck table while suppressing an increase in man-hours.SOLUTION: A method for processing a resin substrate includes: a warped shape forming step ST1 of heating a package substrate while the surface of a package is pressed to be brought into close contact with a convex surface of a curved surface forming substrate and further cooling the package substrate to form, on the package substrate, warpage where the surface side of the package substrate has a concave surface; a placement step ST2 of placing the packaging substrate on the holding surface of a chuck table such that the surface having the concave surface faces the holding surface; a sucking and holding step ST3 of pressing near the center of the back side of the package substrate toward the holding surface, the back side being warped to have a convex surface, and sucking and holding the package substrate by the chuck table while correcting the warpage of the package substrate along the holding surface; and a processing step ST4 of performing grinding processing from the back side of the package substrate sucked and held by the chuck table.SELECTED DRAWING: Figure 4 【課題】工数の増加を抑制しながらも樹脂基板をチャックテーブルに固定することを可能とすることができる樹脂基板の加工方法を提供すること。【解決手段】樹脂基板の加工方法は、曲面形成用基板の凸面にパッケージの表面を密着させるよう押圧した状態でパッケージ基板を加熱し更に冷却して、パッケージ基板の表面側が凹面となる反りをパッケージ基板に形成する反り形状形成ステップＳＴ１と、チャックテーブルの保持面にパッケージ基板の凹面となった表面を対面させて載置する載置ステップＳＴ２と、パッケージ基板の反って凸面になった裏面側の中央付近を保持面に向かって押圧し、パッケージ基板の反りを保持面に沿って矯正しつつチャックテーブルでパッケージ基板を吸引保持する吸引保持ステップＳＴ３と、チャックテーブルで吸引保持したパッケージ基板の裏面側から研削加工を行う加工ステップＳＴ４と、を備える。【選択図】図４