CONDUCTIVE PASTE AND LAMINATED ELECTRONIC COMPONENT

To provide a conductive paste that is baked at a low baking temperature to give a primer electrode layer being compact and well bonded to a laminate.SOLUTION: A conductive paste 1 has a conductive powder 2 having at least one element selected from Cu and Ni, glass powder 3, and organic material 4. T...

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Bibliographic Details
Main Authors TAGA KAZUYA, NISHIZAKA YASUHIRO
Format Patent
LanguageEnglish
Japanese
Published 06.05.2021
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Summary:To provide a conductive paste that is baked at a low baking temperature to give a primer electrode layer being compact and well bonded to a laminate.SOLUTION: A conductive paste 1 has a conductive powder 2 having at least one element selected from Cu and Ni, glass powder 3, and organic material 4. The glass powder 3 has a borosilicate glass composition with a softening point of 455°C or higher and 650°C or lower. A mass spectrum obtained by the mass spectrometry of a gas evolved when a mixture of the glass powder 3 and a C powder is heated and raised in temperature has a gas evolution peak with a mass number of 44 at 470°C or higher and 680°C or lower.SELECTED DRAWING: Figure 1 【課題】低い焼き付け温度で緻密な、かつ積層体との接合性の高い下地電極層を得ることができる導電性ペーストを提供する。【解決手段】導電性ペースト1は、CuおよびNiの中から選ばれる少なくとも1種類の元素を含む導電性粉末2と、ガラス粉末3と、有機材料4とを備える。ガラス粉末3は、軟化点が455℃以上650℃以下であるホウケイ酸系ガラス組成物を含み、かつガラス粉末3とC粉末との混合物の昇温加熱時に発生するガスの質量分析により得られるマススペクトルは、470℃以上680℃以下に質量数44のガス発生ピークを有する。【選択図】図1
Bibliography:Application Number: JP20190195917