RESIN COMPOSITION, RESIN FILM AND METAL-CLAD LAMINATE

• Main Authors: TANAKA MUTSUTO, DEAI HIROYUKI, YAMADA HIROAKI, FUJI MAOTO, WANG HONGYUAN
• Format: Patent
• Language: English; Japanese
• Published: 06.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition and a resin film which improve dielectric characteristics without impairing mechanical characteristics such as bending properties by addition of an inorganic filler.SOLUTION: A resin composition contains a polyamide acid or polyimide, and spherical silica particles. A frequency distribution curve of spherical silica particles obtained by particle size distribution measurement based on volume by a laser diffraction scattering method satisfies a) an average particle diameter D50 where the cumulative value is 50% of 9.0-12.0 μm, b) a particle diameter D90 where the cumulative value is 90% of 15-20 μm, and c) a particle diameter D100 where the cumulative value is 100% of 25 μm or less, and a content of the spherical silica particles is within a range of 20-65 vol.% with respect to the polyamide acid or the polyimide.SELECTED DRAWING: None 【課題】 無機フィラーの添加によって折り曲げ性などの機械的特性を損なうことなく、誘電特性の改善が図られている樹脂組成物及び樹脂フィルムを提供する。【解決手段】 ポリアミド酸又はポリイミドと、球状シリカ粒子と、を含有し、レーザ回折散乱法による体積基準の粒度分布測定によって得られる球状シリカ粒子の頻度分布曲線が、ａ）累積値が５０％となる平均粒子径Ｄ５０が９．０〜１２．０μｍの範囲内であること、ｂ）累積値が９０％となる粒子径Ｄ９０が１５〜２０μｍの範囲内であること、ｃ）累積値が１００％となる粒子径Ｄ１００が２５μｍ以下であること、を満たし、球状シリカ粒子の含有量が、ポリアミド酸又はポリイミドに対し２０〜６５体積％の範囲内である樹脂組成物。【選択図】 なし