RESIN COMPOSITION, RESIN FILM AND METAL-CLAD LAMINATE

• Main Authors: TANAKA MUTSUTO, DEAI HIROYUKI, YAMADA HIROAKI, WANG HONGYUAN
• Format: Patent
• Language: English; Japanese
• Published: 06.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition which enables viscosity adjustment and is hard to generate a void in polyimide even when being filled with a large amount of a spherical filler.SOLUTION: A resin composition contains a polyamide acid or polyimide, and spherical alumina particles, and a content of the spherical alumina particles is within a range of 5-80 vol.% with respect to the polyamide acid or the polyimide. In addition, 90 wt.% or more of the spherical alumina particles satisfy conditions of a) an average particle diameter D50 where the cumulative value in a frequency distribution curve obtained by particle size distribution measurement based on volume by a laser diffraction scattering method is 50% of 0.5-5 μm, b) circularity of 0.9 or more, and c) true specific gravity of 3.4-3.8.SELECTED DRAWING: None 【課題】 球状のフィラーを多量に充填させた場合においても、粘度調整が可能であり、ポリイミド中に空隙が生じにくい樹脂組成物を提供する。【解決手段】 樹脂組成物は、ポリアミド酸又はポリイミドと、球状アルミナ粒子と、を含有し、球状アルミナ粒子の含有量がポリアミド酸又はポリイミドに対し５〜８０体積％の範囲内である。球状アルミナ粒子の９０重量％以上が、ａ）レーザ回折散乱法による体積基準の粒度分布測定によって得られる頻度分布曲線における累積値が５０％となる平均粒子径Ｄ５０が０．５〜５μｍの範囲内である、ｂ）円形度が０．９以上である、ｃ）真比重が３．４〜３．８の範囲内である、という条件を満たす。【選択図】 なし