SILICA PARTICLE, RESIN COMPOSITION, RESIN FILM, AND METAL-CLAD LAMINATE

• Main Authors: TANAKA MUTSUTO, HIRAISHI KATSUFUMI, DEAI HIROYUKI, WANG HONGYUAN, FUJI MAOTO
• Format: Patent
• Language: English; Japanese
• Published: 06.05.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INORGANIC CHEMISTRY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide silica particles which can improve dielectric characteristics without impairing mechanical characteristics such as bending properties, and a resin composition and a resin film which improve dielectric characteristics by addition of the silica particles.SOLUTION: Silica particles are used in a frequency region of 3-20 GHz, and have an average particle diameter D50 here the cumulative value in a frequency distribution curve obtained by particle size distribution measurement based on volume by a laser diffraction scattering method is 50% of 0.3-3 μm, have a specific surface area of more than 5 m2/g and 20 m2/g or less, and have a dielectric loss tangent measured by a cavity resonator perturbation method of 0.004 or less. The resin composition contains the above silica particles, a polyamide acid or polyimide, and a content of the silica particles is within a range of 30-70 vol.% with respect to the polyamide acid or the polyimide.SELECTED DRAWING: None 【課題】 折り曲げ性などの機械的特性を損なうことなく、誘電特性の改善を図ることが可能なシリカ粒子及び該シリカ粒子の添加によって、誘電特性が改善された樹脂組成物及び樹脂フィルムを提供する。【解決手段】 シリカ粒子は、３〜２０ＧＨｚの周波数領域で用いられるものであり、レーザ回折散乱法による体積基準の粒度分布測定によって得られる頻度分布曲線における累積値が５０％となる平均粒子径Ｄ５０が０．３〜３μｍの範囲内、比表面積が５ｍ２／ｇを超え２０ｍ２／ｇ以下の範囲内であり、空洞共振器摂動法によって測定される誘電正接が０．００４以下である。樹脂組成物は、上記シリカ粒子と、ポリアミド酸又はポリイミドと、を含有し、シリカ粒子の含有量が、ポリアミド酸又はポリイミドに対し、３０〜７０体積％の範囲内である。【選択図】 なし