FLUORINE RESIN SUBSTRATE LAMINATE

• Main Authors: MURAI KOSUKE, KAKIYA MINORU, YANAGIDA MAKOTO, SHIMADA MAMI, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 06.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

To provide a fluorine resin substrate laminate having low hygroscopicity and excellent low dielectric constant and low dielectric loss tangent, and in which transmission loss in a high frequency region can be reduced.SOLUTION: A fluorine resin substrate laminate for a high frequency circuit comprises a fluorine resin substrate and an adhesive layer provided on the fluorine resin substrate, and the adhesive layer comprises a resin composition comprising (A) a maleimide compound having a saturated or unsaturated bivalent hydrocarbon group and (B) an aromatic maleimide compound.SELECTED DRAWING: Figure 1 【課題】吸湿性が低く、優れた低誘電率及び低誘電正接を有すると共に、高周波領域における伝送損失を低減できるフッ素樹脂基板積層体を提供すること。【解決手段】本開示は、フッ素樹脂基板と、該フッ素樹脂基板上に設けられた接着層と、を備え、接着層が、（Ａ）飽和又は不飽和の２価の炭化水素基を有するマレイミド化合物と、（Ｂ）芳香族マレイミド化合物と、を含有する樹脂組成物を含む、高周波回路用のフッ素樹脂基板積層体に関する。【選択図】図１