SEMICONDUCTOR DEVICE
To provide a semiconductor device that can obtain stable characteristics.SOLUTION: According to one embodiment, a semiconductor device includes a substrate containing silicon carbide, a first semiconductor member with a first conductivity type containing silicon carbide, and a second semiconductor m...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
22.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor device that can obtain stable characteristics.SOLUTION: According to one embodiment, a semiconductor device includes a substrate containing silicon carbide, a first semiconductor member with a first conductivity type containing silicon carbide, and a second semiconductor member with a second conductivity type containing silicon carbide. A first direction from the substrate to the first semiconductor member is along a [0001] direction of the substrate. The second semiconductor member includes a first region, a second region, and a third region. The first semiconductor member includes a fourth region. A second direction from the first region to the second region is along a [1-100] direction of the substrate. The fourth region exists between the first region and the second region in the second direction. A third direction from the fourth region to the third region is along a [11-20] direction of the substrate.SELECTED DRAWING: Figure 1
【課題】安定した特性が得られる半導体装置を提供する。【解決手段】実施形態によれば、半導体装置は、炭化珪素を含む基体と、炭化珪素を含む第1導電形の第1半導体部材と、炭化珪素を含む第2導電形の第2半導体部材と、を含む。前記基体から前記第1半導体部材への第1方向は、前記基体の[0001]方向に沿う。前記第2半導体部材は、第1領域、第2領域及び第3領域を含む。前記第1半導体部材は、第4領域を含む。前記第1領域から前記第2領域への第2方向は、前記基体の[1−100]方向に沿う。前記第4領域は、前記第2方向において前記第1領域及び前記第2領域との間にある。前記第4領域から前記第3領域への第3方向は、前記基体の[11−20]方向に沿う。【選択図】図1 |
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Bibliography: | Application Number: JP20190189278 |