SOLDER ALLOY AND SOLDER POWDER

To propose a new solder powder for preparing solder paste, the solder powder capable of suppressing a viscosity rise in the prepared paste.SOLUTION: A solder powder is composed of a solder alloy that contains Sn of 90.0-99.8 wt.% and Ag of 0.1-6 wt.%, contains As in a mass ratio of 30 ppm-100 ppm, a...

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Bibliographic Details
Main Authors GYODA KEIGO, UWAZUMI YOSHIAKI
Format Patent
LanguageEnglish
Japanese
Published 22.04.2021
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:To propose a new solder powder for preparing solder paste, the solder powder capable of suppressing a viscosity rise in the prepared paste.SOLUTION: A solder powder is composed of a solder alloy that contains Sn of 90.0-99.8 wt.% and Ag of 0.1-6 wt.%, contains As in a mass ratio of 30 ppm-100 ppm, and contains Cu as the balance, wherein the solder powder contains oxygen in a mass ratio of 50 ppm-150 ppm.SELECTED DRAWING: None 【課題】半田ペーストを作製するための半田粉に関し、ペースト作製後の粘度上昇を抑制することができる、新たな半田粉を提案せんとする。【解決手段】Ｓｎを９０．０〜９９．８ｗｔ％含有し、Ａｇを０．１〜６ｗｔ％を含有し、Ａｓを質量割合３０ｐｐｍ〜１００ｐｐｍ含有し、残部としてＣｕを含有する半田合金からなる半田粉であって、酸素を質量割合で５０ｐｐｍ〜１５０ｐｐｍで含有する半田粉である。【選択図】なし
Bibliography:Application Number: JP20210007657