RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME AND MULTILAYERED STRUCTURE INCLUDING THE SAME
To provide a resin composition that has excellent gas barrier properties and excellent moisture resistance in a high temperature-high humidity environment and causes little effluent when treated with water vapor or hot water.SOLUTION: A resin composition contains EVOH (A), a desiccant (B) and a ther...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
15.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a resin composition that has excellent gas barrier properties and excellent moisture resistance in a high temperature-high humidity environment and causes little effluent when treated with water vapor or hot water.SOLUTION: A resin composition contains EVOH (A), a desiccant (B) and a thermoplastic resin (C). The resin composition contains an ethylene-vinyl alcohol copolymer (A) of 50 mass% or more, and contains the desiccant (B) of 0.1-30 pts.mass and the thermoplastic resin (C) of 0.2-30 pts.mass relative to the EVOH (A) 100 pts.mass. The thermoplastic resin (C) has a carboxyl group, a carboxylic acid anhydride group or an epoxy group.SELECTED DRAWING: Figure 2
【課題】ガスバリア性及び高温高湿下での耐湿性に優れるとともに、水蒸気又は熱水で処理した際に溶出物が少ない樹脂組成物を提供する。【解決手段】EVOH(A)、乾燥剤(B)及び熱可塑性樹脂(C)を含む樹脂組成物であって、エチレン−ビニルアルコール共重合体(A)を50質量%以上含有し、EVOH(A)100質量部に対して、乾燥剤(B)を0.1〜30質量部と熱可塑性樹脂(C)を0.2〜30質量部とを含有し、熱可塑性樹脂(C)がカルボキシル基、カルボン酸無水物基又はエポキシ基を含有する、樹脂組成物である。【選択図】図2 |
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Bibliography: | Application Number: JP20190183341 |