RESIN LAMINATE FOR LOW-DIELECTRIC MATERIAL

• Main Author: IWAMOTO TAKEHIRO
• Format: Patent
• Language: English; Japanese
• Published: 15.04.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

To provide a resin laminate for low-dielectric material that has low dielectric loss and high toughness and is suitable for an electronic component, particularly a circuit board, a resin plate for a millimeter wave radome, and a resin plate with good radio wave transmissivity.SOLUTION: A resin laminate for low-dielectric material, having a total of at least three laminated layers, comprising, layered alternately, a resin layer (S) 3 that includes a styrene resin (S1) having a syndiotactic structure and a resin layer (M) 2 that includes a resin (M1) having a softening point of no more than 260°C. The outermost layers are resin layers (S) 3.SELECTED DRAWING: Figure 1 【課題】誘電損失が低く、高い靭性を有する、電子部品、特に回路基板、ミリ波レドーム用樹脂板、良電波透過性樹脂板に適した低誘電材用樹脂積層体の提供。【解決手段】シンジオタクチック構造を有するスチレン系樹脂（Ｓ１）を含む樹脂層（Ｓ）３と軟化点が２６０℃以下の樹脂（Ｍ１）を含む樹脂層（Ｍ）２が交互に合計３層以上積層され、最外層が樹脂層（Ｓ）３である、低誘電材用樹脂積層体。【選択図】図１