MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

• Main Authors: SAKAMOTO HITOSHI, SATO HIDEJI
• Format: Patent
• Language: English; Japanese
• Published: 08.04.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; RESISTORS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SPRAYING OR ATOMISING IN GENERAL; TRANSFORMERS; TRANSPORTING

To provide a manufacturing apparatus and a manufacturing method of an electronic component capable of increasing the throughput and making the shape of a conductive paste layer formed at the end of the electronic component body uniform.SOLUTION: A manufacturing apparatus of an electronic component i...