MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

• Main Authors: SAKAMOTO HITOSHI, SATO HIDEJI
• Format: Patent
• Language: English; Japanese
• Published: 08.04.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; RESISTORS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SPRAYING OR ATOMISING IN GENERAL; TRANSFORMERS; TRANSPORTING

To provide a manufacturing apparatus and a manufacturing method of an electronic component capable of increasing the throughput and making the shape of a conductive paste layer formed at the end of the electronic component body uniform.SOLUTION: A manufacturing apparatus of an electronic component includes a jig 20 that aligns and supports a plurality of electronic component bodies 1 in a horizontal plane, a paste removing member 200 having a plurality of through holes 212 equal to or more than the number of electronic components bodies 1, a vertical drive unit that moves the jig 20 and the paste removing member 200 relatively vertically, and a horizontal drive unit that moves the jig 20 and the paste removing member 200 relatively horizontally. Due to vertical movement and horizontal movement, an excess paste material 4B of the paste material 4 applied to each end of the plurality of electronic component bodies 1 is removed at the edge 212A of the plurality of through holes 212.SELECTED DRAWING: Figure 11 【課題】スループットを高め、電子部品本体の端部に形成される導電性ペースト層の形状を均一にすることができる電子部品の製造装置及び製造方法を提供する。【解決手段】電子部品の製造装置は、複数の電子部品本体１を水平面内で整列させて支持する治具２０と、複数の電子部品本体１と同数以上の複数の貫通孔２１２を有するペースト除去部材２００と、治具２０とペースト除去部材２００とを相対的に垂直移動させる垂直駆動部と、治具２０とペースト除去部材２００とを相対的に水平移動させる水平駆動部とを有する。垂直移動と水平移動とにより、複数の貫通孔２１２のエッジ２１２Ａで、複数の電子部品本体１の各々の端部に塗布されたペースト材４のうち、余分なペースト材４Ｂを除去する。【選択図】図１１