SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• Main Author: MURATA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 08.04.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor device, and a manufacturing method thereof which can suppress damage to a bonding wire.SOLUTION: A semiconductor device according to the present invention includes a base plate, a first semiconductor chip provided on the base plate, a bonding wire that is bonded to the first semiconductor chip by a first bonding portion, and has a curved portion above the first bonding portion, a first sealing member provided from the upper surface of the base plate to the height higher than the first joint portion and lower than the curved portion and covering the first joint portion, and a second sealing member provided on the first sealing member, covering the curved portion, and having a lower elastic modulus than the first sealing member.SELECTED DRAWING: Figure 1 【課題】本発明は半導体装置および半導体装置の製造方法に関し、ボンディングワイヤの損傷を抑制できる半導体装置および半導体装置の製造方法を得ることを目的とする。【解決手段】本発明に係る半導体装置は、ベース板と、該ベース板の上に設けられた第１半導体チップと、該第１半導体チップと第１接合部で接合され、該第１接合部よりも上方に湾曲部を有するボンディングワイヤと、該ベース板の上面から該第１接合部よりも高く該湾曲部よりも低い高さまで設けられ、該第１接合部を覆う第１封止部材と、該第１封止部材の上に設けられ、該湾曲部を覆い、該第１封止部材よりも弾性率が低い第２封止部材と、を備える。【選択図】図１