SEMICONDUCTOR DEVICE
To improve a proof pressure ability of a semiconductor device comprising a trench type switching element and a current sense element.SOLUTION: A semiconductor device comprises: a trench type switching element formed in an active region 101; and a trench type current sense element formed in a current...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
25.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To improve a proof pressure ability of a semiconductor device comprising a trench type switching element and a current sense element.SOLUTION: A semiconductor device comprises: a trench type switching element formed in an active region 101; and a trench type current sense element formed in a current sense region 102. Protective layers 8a, 8b, and 8c are formed, respectively, at lower parts of a trench 5a into which a gate electrode 7a of the switching element is embedded, a trench 5b into which a gate electrode 7b of the current sense element is embedded, and a trench 5c which is formed at a boundary part of the active region 101 and the current sense region 102. The protective layer 8c of the boundary part of the active region 101 and the current sense region 102, includes a divided part 15 divided in a direction directed to the current sense region 102 from the active region 101.SELECTED DRAWING: Figure 1
【課題】トレンチ型のスイッチング素子および電流センス素子を備える半導体装置の耐圧能力を向上させる。【解決手段】半導体装置は、活性領域101に形成されたトレンチ型のスイッチング素子と、電流センス領域102に形成されたトレンチ型の電流センス素子とを備える。スイッチング素子のゲート電極7aが埋め込まれたトレンチ5a、電流センス素子のゲート電極7bが埋め込まれたトレンチ5b、および、活性領域101と電流センス領域102との境界部分に形成されたトレンチ5cの下方には、それぞれ保護層8a,8b,8cが形成されている。活性領域101と電流センス領域102との境界部分の保護層8cは、活性領域101から電流センス領域102へ向かう方向に分断された分断部15を有している。【選択図】図1 |
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Bibliography: | Application Number: JP20190170127 |