SEMICONDUCTOR MULTIFACETED SUBSTRATE MEMBER, SEMICONDUCTOR MULTIFACETED SUBSTRATE, AND SEMICONDUCTOR MEMBER

• Main Authors: CHIGIRA ATSUKO, MAWATARI HIROSHI, SASAO KEITA, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 25.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor multifaceted substrate member capable of obtaining a semiconductor multifaceted substrate which can suppress a peeling in a peeling layer at a cutting as a main purpose.SOLUTION: A semiconductor multifaceted substrate member for forming a semiconductor multifaceted substrate which can be divided into a plurality of semiconductor members by a cutting, includes: a glass material; a peeling layer arranged on one main surface side of the glass material; and a wiring layer arranged on a main surface at the side opposite to the glass material on the peeling layer. The peeling layer is not arranged on a cutting wire of the glass material at the cutting when the semiconductor multifaceted substrate is cut into a plurality of semiconductor members.SELECTED DRAWING: Figure 1 【課題】本開示は、切断時における剥離層での剥離を抑制することが可能な半導体多面付け基板を得ることができる半導体多面付け基板用部材を提供することを主目的とする。【解決手段】切断により複数の半導体部材に分割されうる半導体多面付基板を形成するための半導体多面付基板用部材であって、ガラス基材と、上記ガラス基材の一方の主面側に配置された剥離層と、上記剥離層の上記ガラス基板とは反対側の主面に配置された配線層とを有し、上記半導体多面付け基板を複数の半導体部材に切断する際の切断時における上記ガラス基材の切断線上に、上記剥離層が配置されていないことを特徴とする、半導体多面付け基板用部材を提供する。【選択図】図１