ELECTROLESS PLATING INHIBITING COMPOSITION AND METHOD FOR MANUFACTURING PLATED COMPONENT

• Main Authors: YUSA ATSUSHI, USUKI NAOKI, TSUCHIHATA MIYUKI, KITO AKIKO
• Format: Patent
• Language: English; Japanese
• Published: 25.03.2021
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide an electroless plating inhibiting composition that can suppress generation of an electroless plating film in a part where an electroless plating film is not planned to be formed and has excellent dispersion stability.SOLUTION: An electroless plating inhibiting composition includes: a catalytic activity inhibitor that is a compound including at least one of the amide group and amino group; and a solvent including glycol ether. The catalytic activity inhibitor is a branched polymer including a side chain including at least one of the amide group and the amino group.SELECTED DRAWING: None 【課題】無電解メッキ膜の形成を予定していない部分での無電解メッキ膜の生成を抑制でき、分散安定性の高い無電解メッキ抑制組成物を提供する。【解決手段】無電解メッキ抑制組成物であって、アミド基及びアミノ基の少なくとも一方を有する化合物である触媒活性妨害剤と、グリコールエーテルを含む溶剤とを含む。前記触媒活性妨害剤が、前記アミド基及び前記アミノ基の少なくとも一方を含む側鎖を有する分岐ポリマーである。【選択図】 なし