EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

• Main Authors: FUSUMADA MITSUAKI, KANG DONGOL, NAKAMURA SHINYA
• Format: Patent
• Language: English; Japanese
• Published: 25.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an epoxy resin composition having excellent storage stability, curability and adhesiveness.SOLUTION: An epoxy resin composition has an epoxy resin, a curing agent, and a salt of a cation derived from an adduct of a phosphine compound and a quinone compound and an anion derived from a carboxylic acid compound having a structure in which adjacent two carbon atoms are both substituted with carboxy groups.SELECTED DRAWING: None 【課題】保存安定性、硬化性及び接着性に優れるエポキシ樹脂組成物の提供。【解決手段】エポキシ樹脂組成物は、エポキシ樹脂と、硬化剤と、ホスフィン化合物とキノン化合物との付加反応物由来のカチオンと、隣り合う２つの炭素原子が共にカルボキシ基で置換された構造を有するカルボン酸化合物由来のアニオンと、の塩と、を含有する。【選択図】なし