COATING TREATMENT METHOD, COATING TREATMENT DEVICE, AND STORAGE MEDIUM

• Main Authors: HASHIMOTO YUSAKU, SHIBATA DAIKI, KAWAKITA MASATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 18.03.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To provide a coating treatment method and a coating treatment device effective for improving the in-plane uniformity of the film thickness of a coating film formed on a substrate.SOLUTION: A coating treatment method includes the steps of: rotating a substrate at a first rotation speed, and stopping supplying a film-forming liquid before the film-forming liquid supplied to the surface of the substrate reaches the outer periphery of the substrate while supplying the film-forming liquid to the center of the surface of the substrate; continuing the rotation of the substrate at a second rotation speed after the supply of the film forming liquid is stopped; and supplying a gas-liquid mixed cooling fluid to the outer peripheral portion of the back surface of the substrate during a supply period including at least a part of a period from the stop of the supply of the film-forming liquid to the completion of the rotation of the substrate at the second rotation speed.SELECTED DRAWING: Figure 2 【課題】基板に形成される被膜の膜厚の面内均一性向上に有効な塗布処理方法及び塗布処理装置を提供する。【解決手段】塗布処理方法は、基板の表面の中心に成膜液を供給しながら、第１回転速度にて基板を回転させ、基板の表面に供給された成膜液が基板の外周に到達する前に成膜液の供給を停止させることと、成膜液の供給が停止した後、第２回転速度にて基板の回転を継続させることと、成膜液の供給が停止した後、第２回転速度による基板の回転が完了するまでの期間の少なくとも一部を含む供給期間において、気液混合の冷却流体を基板の裏面の外周部分に供給することと、を含む。【選択図】図２