COMPOSITE SHEET FOR FORMING PROTECTIVE FILM

• Main Author: KOMASU YUICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 11.03.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a composite sheet for forming a protective film that can suppress components of an energy line curable adhesive moving to a film for forming a protective film before energy line curing, and can peel a semiconductor chip with a protective film from a support sheet without peeling between the semiconductor chip and the protective film when picking up the semiconductor chip with the protective film from the support sheet.SOLUTION: A composite sheet for forming a protective film comprises a substrate, wherein an energy line curable adhesive layer and a film for forming a protective film are laminated in contact with each other in this order on one surface of the substrate, a gel fraction of the adhesive layer is 80% or more, or the gel fraction of the adhesive layer is 20% or more and lower than 80%, and a glass transition temperature of the film for forming the protective film is 3°C or more.SELECTED DRAWING: None 【課題】エネルギー線硬化前に、エネルギー線硬化性粘着剤の成分が保護膜形成用フィルムに移行することを抑制することができ、保護膜付き半導体チップを支持シートからピックアップする際に、半導体チップと保護膜との間で剥離することなく、保護膜付き半導体チップを支持シートから剥離することが可能な保護膜形成用複合シートの提供。【解決手段】基材を備え、前記基材の一方の面上に、エネルギー線硬化性粘着剤層及び保護膜形成用フィルムがこの順に、互いに接触して積層されており、前記粘着剤層のゲル分率が８０％以上であるか、又は前記粘着剤層のゲル分率が２０％以上８０％未満であって、前記保護膜形成用フィルムのガラス転移温度が３℃以上である、保護膜形成用複合シート。【選択図】なし