IMPRINTING METHOD, IMPRINT APPARATUS, AND ARTICLE MANUFACTURING METHOD

To provide an imprinting method in which a pattern of an imprint material can be formed on a substrate while damage of a pattern of a mold due to foreign particle is more reliably prevented.SOLUTION: An imprinting method includes: a foreign particle detection step S101 of detecting a foreign particl...

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Bibliographic Details
Main Authors HATTORI TADASHI, AOKI AKIO
Format Patent
LanguageEnglish
Japanese
Published 04.03.2021
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:To provide an imprinting method in which a pattern of an imprint material can be formed on a substrate while damage of a pattern of a mold due to foreign particle is more reliably prevented.SOLUTION: An imprinting method includes: a foreign particle detection step S101 of detecting a foreign particle present on a surface of a substrate; a supply step S106 of supplying an imprint material on the substrate; a pattern forming step S107 of forming a pattern by bringing a pattern of a mold into contact with the imprint material of a predetermined shot region on the substrate after supplying the imprint material; and a foreign particle pressing step S105 of pressing the foreign particle present on the surface of the substrate in the predetermined shot region detected by the foreign particle detection step, using a pressing surface of a pressing unit facing the surface of the substrate, before the pattern forming step. In the foreign particle pressing step, the foreign particle is pressed so that a height of the foreign particle from the surface of the substrate is smaller than a film thickness of the imprint material after the pattern forming step.SELECTED DRAWING: Figure 1 【課題】異物によるモールドのパターンの破損をより確実に防ぎつつ基板上にインプリント材のパターンを形成可能なインプリント方法を提供する。【解決手段】基板の表面に存在する異物を検出する異物検出工程Ｓ１０１と、基板上にインプリント材を供給する供給工程Ｓ１０６と、インプリント材を供給後に、基板上の所定のショット領域のインプリント材とモールドのパターンを接触させてパターンを形成するパターン形成工程Ｓ１０７と、異物検出工程によって検出された基板の所定のショット領域の表面に存在する異物を、パターン形成工程の前に基板の表面に対向させた押圧部の押圧面によって押圧する異物押圧工程Ｓ１０５と、を含み、異物押圧工程では、パターン形成工程の後のインプリント材の膜厚よりも異物の前記基板の表面からの高さが低くなるように異物を押圧する、ことを特徴とするインプリント方法。【選択図】図１
Bibliography:Application Number: JP20200118477