EPOXY RESIN COMPOSITION

• Main Authors: IWATANI KAZUKI, SAITO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an epoxy resin composition that is cured in a short time even under low-temperature conditions to yield a cured product having a low glass transition point (Tg) and a high pull strength; a sealing material containing the same; a cured product obtained by curing the composition; and an electronic component including the cured product.SOLUTION: As a component of the curable composition, a crosslinking density regulator containing an aromatic monofunctional epoxy resin in addition to a thiol-based curing agent and an epoxy resin is used, and the physical properties values of a cured product provided by the curable composition are adjusted so as to be within a predetermined range.SELECTED DRAWING: Figure 1 【課題】低温条件下でも短時間で硬化して、ガラス転移点（Ｔｇ）が低く、プル強度の高い硬化物を与えるエポキシ樹脂組成物、それを含む封止材、それを硬化させて得られる硬化物及びその硬化物を含む電子部品の提供。【解決手段】硬化性組成物の成分として、チオール系硬化剤とエポキシ樹脂に加え、芳香族単官能エポキシ樹脂を含む架橋密度調節剤を用い、この硬化性組成物が与える硬化物の物性値が所定の範囲となるように調節する。【選択図】図１