METHOD AND DEVICE FOR PROCESSING SUBSTRATE

• Main Authors: NAKAKAWANISHI MANABU, CHIHAYA HIROAKI, TAKEYAMA TAMAKI, IMOTO SHINJI, YAMAGATA MOTOKI
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a method and a device for processing a substrate, which can shorten a time required to reach a steady cooling temperature when a substrate is processed while being rotated in a state of being cooled to an extremely low temperature.SOLUTION: A method of fixedly arranging an extremely low temperature refrigerated heat transfer body on the back surface side of a rotatably provided stage via a gap, supplying cooling gas to the gap to cool the stage, and keeping the stage at a constant cooling temperature within a certain range while rotating the stage in a state in which the substrate is placed on the stage to process the substrate with specific temperature above room temperature includes the step of preheating the stage such that the temperature of the stage becomes steady cooling temperature, and continuously executing substrate processing for a plurality of substrates while rotating the stage and placing the substrate on the stage at the steady cooling temperature after the preheat.SELECTED DRAWING: Figure 5 【課題】基板を極低温に冷却した状態で回転させつつ処理する際に、定常冷却温度に達するまでの時間を短縮することができる基板を処理する方法および装置を提供する。【解決手段】回転可能に設けられたステージの裏面側に隙間を介して、極低温の冷凍伝熱体を固定配置し、隙間に冷却ガスを供給してステージを冷却し、ステージ上に基板を載置した状態でステージを回転させながらステージを一定範囲の定常冷却温度に保持し、常温以上の特定温度の基板を処理する方法は、ステージの温度が定常冷却温度になるようにステージをプリヒートすることと、プリヒート後、定常冷却温度のステージ上に基板を載置しつつステージを回転させながら行う基板処理を複数の基板に対して連続して行うこととを有する。【選択図】図５