LAMINATED ELECTRONIC COMPONENT
To provide a laminated electronic component capable of improving the bonding force between an internal electrode layer and a dielectric layer in which a CZ-based dielectric material is used.SOLUTION: A laminated electronic component includes a laminate 10 in which a plurality of dielectric layers 11...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
01.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a laminated electronic component capable of improving the bonding force between an internal electrode layer and a dielectric layer in which a CZ-based dielectric material is used.SOLUTION: A laminated electronic component includes a laminate 10 in which a plurality of dielectric layers 11 including a CZ-based perovskite phase and a plurality of internal electrode layers 12 including Cu are laminated. The dielectric layers 11 each further include an element M1, and have an interface layer including the element M1 on at least part of an interface with the respective internal electrode layer 12. The element M1 is an element having a bonding energy between CZ and Cu via the element M1 of -9.8 eV or less, the binding energy being obtained by a first principal-calculation using a pseudopotential method. When an amount of elements included in the dielectric layer 11 is represented by parts by mole, a ratio m1 of an amount of the element M1 in the interface layer to an amount of Zr satisfies 0.03≤m1≤0.25.SELECTED DRAWING: Figure 4
【課題】CZ系の誘電体材料が用いられた誘電体層と内部電極層との結合力を向上させることができる、積層型電子部品を提供する。【解決手段】積層型電子部品は、CZ系のペロブスカイト相を含む複数の誘電体層11と、Cuを含む複数の内部電極層12とが積層された積層体10を備える。誘電体層11は、元素M1をさらに含み、かつ内部電極層12との界面の少なくとも一部に、元素M1を含む界面層を有する。ただし、元素M1は、擬ポテンシャル法が用いられた第一原理計算による、元素M1を介したCZとCuとの結合エネルギーが−9.8eV以下である元素である。そして、誘電体層11に含まれる元素の量をモル部で表した場合、界面層における元素M1の量のZrの量に対する比m1が0.03≦m1≦0.25である。【選択図】図4 |
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Bibliography: | Application Number: JP20190155182 |