ELECTRONIC APPARATUS

• Main Author: HASEGAWA TOMOHIRO
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide an electronic apparatus in which a first electronic component can be cooled by natural wind cooling, without providing a duct in the enclosure.SOLUTION: In an electronic apparatus 1 equipped with an electronic substrate 15 having a first radiator 19 adhering to a first electronic component and promoting heat dissipation therefrom, and an enclosure for receiving the electronic substrate 15, the bottom wall 3b and the top wall of the enclosure are provided, respectively, with multiple openings, and the electronic substrate 15 is fixed in the enclosure in such a posture that the heat slinger 19a of the first radiator 19 is extended in the vertical direction of the enclosure. The electronic substrate 15 is equipped with a second radiator 29 adhering to at least a second electronic component and a third electronic component 24 lined up in the vertical direction, and promoting heat release from the second and third electronic components. The second radiator 29 extends a heat slinger 29a in the vertical direction so as to face the heat slinger 19a of the first radiator 19.SELECTED DRAWING: Figure 4 【課題】筐体内にダクトを設けることなく、第１電子部品を自然風冷で冷却することができる電子装置を提供する。【解決手段】第１電子部品に密着して第１電子部品からの放熱を促す第１放熱器１９を有する電子基板１５と、電子基板１５を収容する筐体とを備え、筐体の底壁３ｂ及び天壁のそれぞれが、複数の開口を備え、且つ、電子基板１５が、第１放熱器１９の放熱板１９ａを筐体の上下方向に延在させる姿勢で筐体内に固定される電子装置１であって、電子基板１５が、互いに上下方向に並ぶ少なくとも第２電子部品及び第３電子部品２４に密着して第２電子部品及び第３電子部品からの放熱を促す第２放熱器２９を備える。第２放熱器２９が、放熱板２９ａを上下方向に延在させて第１放熱器１９の放熱板１９ａに対向させる。【選択図】図４