SEALING FILM, SEALING STRUCTURE, AND MANUFACTURING METHOD OF SEALING STRUCTURE

• Main Authors: TSUCHIKAWA YOSHIYUKI, HAMA MASAYUKI, NOMURA YUTAKA, WATASE YUSUKE, OIZUMI ATSUSHI, ISHIGE HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

To provide a sealing film capable of reducing warpage of a sealing structure while realizing thinning of the sealing structure, a sealing structure using the sealing film, and a manufacturing method of the sealing structure.SOLUTION: A sealing film includes: a first layer including a thermosetting resin and an inorganic filler; a second layer including a thermosetting resin and an inorganic filler; and glass cloth. When the second layer is cured, a resultant cured product has a coefficient of thermal expansion that is higher that of a cured product of the first layer.SELECTED DRAWING: None 【課題】封止構造体の薄型化を実現しつつ、封止構造体の反りを低減することができる封止用フィルム、これを用い用いた封止構造体、及び封止構造体の製造方法の提供。【解決手段】熱硬化性樹脂及び無機充填材を有する第１の層と、熱硬化性樹脂及び無機充填材を有し、硬化物としたときの熱膨張率が前記第１の層を硬化物としたときの熱膨張率よりも大きい第２の層と、ガラスクロスと、を備えた封止用フィルムである。【選択図】なし