EPOXY RESIN COMPOSITION

• Main Authors: IWATANI KAZUKI, SAITO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide an epoxy resin composition that exhibits low viscosity and is cured in a short time even under low-temperature conditions to yield a cured product having a low glass transition point (Tg) and excellent moisture resistance reliability after curing.SOLUTION: There is provided an epoxy resin composition including: (A) at least one thiol-based curing agent containing a polyfunctional thiol compound having three or more thiol groups; (B) at least one polyfunctional epoxy resin; (C) a crosslinking density regulator comprising at least one aromatic monofunctional epoxy resin; and (D) a curing catalyst. A ratio of an epoxy functionality equivalent for the component (B) to a thiol functionality equivalent for the component (A) ([epoxy functionality equivalent]/[thiol functionality equivalent]) is 0.40 or more and 0.70 or less, and the epoxy functionality equivalent for the component (C) to the thiol functionality equivalent for the component (A) ([epoxy functionality equivalent]/[thiol functionality equivalent]) is 0.10 or more and 0.55 or less.SELECTED DRAWING: None 【課題】低粘度であり、低温条件下でも短時間で硬化して、ガラス転移点（Ｔｇ）が低く、硬化後に耐湿信頼性に優れる硬化物を与えるエポキシ樹脂組成物を提供すること。【解決手段】（Ａ）少なくとも１種の、チオール基を３つ以上有する多官能チオール化合物を含むチオール系硬化剤；（Ｂ）少なくとも１種の多官能エポキシ樹脂；（Ｃ）少なくとも１種の芳香族単官能エポキシ樹脂を含む架橋密度調節剤；及び（Ｄ）硬化触媒を含み、前記成分（Ｂ）についてのエポキシ官能基当量の、前記成分（Ａ）についてのチオール官能基当量に対する比（〔エポキシ官能基当量〕／〔チオール官能基当量〕）が、０．４０以上、０．７０以下であり、前記成分（Ｃ）についてのエポキシ官能基当量の、前記成分（Ａ）についてのチオール官能基当量に対する比（〔エポキシ官能基当量〕／〔チオール官能基当量〕）が、０．１０以上、０．５５以下である、エポキシ樹脂組成物。【選択図】なし