PREPARATION METHOD OF CHAMBER UNDERCOAT FOR LOW TEMPERATURE ALD COATING

• Main Authors: KANG HU, ADRIEN LAVOIE, QIAN JUN
• Format: Patent
• Language: English; Japanese
• Published: 18.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a method of forming and using an undercoat on the inner surface of a reaction chamber used for depositing a coating on a substrate.SOLUTION: A undercoat volume method deposited by atomic layer deposition introduce a first reactant into a reaction chamber, a second reactant into the reaction chamber, and exposes the chamber to plasma to provoke a reaction with the first and second reactants.EFFECT: An undercoat helps prevent metal contamination, improves resistance to flaking, and is relatively thin. The excellent resistance to flaking allows more substrates to be processed between one wash operation and the next wash operation, thereby increasing throughput.SELECTED DRAWING: Figure 3 【課題】基板上に被膜を堆積するために使用される反応チャンバの内面上でのアンダーコートの形成方法および使用方法を提供する。【解決手段】原子層堆積処理によって堆積されるアンダーコート体積方法は、第１の反応物を反応チャンバ内に導入し、第２反応物を反応チャンバ内に導入し、第１の反応物及び第２の反応物との反応を誘発するためにチャンバをプラズマに曝す。【効果】アンダーコートは、金属汚染を防止する一助となり、剥落に対する耐性を改良し、比較的薄い。剥落に対する優れた耐性により、ある洗浄操作と次の洗浄操作との間でより多くの基板が処理され、それによりスループットを高める。【選択図】図３