SEMICONDUCTOR PROCESSING TOOL

To provide a substrate processing tool which can be minimized in down time and can minimize substrate particle contamination.SOLUTION: A substrate processing tool 690 includes: a frame forming a modular unit that can be coupled, as one unit, to a transport chamber 625; sealable chambers formed withi...

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Main Authors ALEXANDER KRUPYSHEV, MARTIN R ELLIOT, JOSEPH HALLISEY, CHRISTOPHER HOFMEISTER, CRAIG J CARBONE, BLAHNIK JEFFREY C, JOSEPH A KRAUS, WILLIAM FOSNIGHT, FONG HI YIN OWEN
Format Patent
LanguageEnglish
Japanese
Published 18.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a substrate processing tool which can be minimized in down time and can minimize substrate particle contamination.SOLUTION: A substrate processing tool 690 includes: a frame forming a modular unit that can be coupled, as one unit, to a transport chamber 625; sealable chambers formed within the modular unit, the sealable chambers being stacked one above the other; and a common fluid transport manifold individually coupled to each of the stacked sealable chambers. The common fluid transport manifold has an individual connection interface to individually connect to each of the stacked sealable chambers. The individual connection interface has a common arrangement so as to be exchangeable for the connection with each of the stacked sealable chambers.SELECTED DRAWING: Figure 2 【課題】基板処理ツールのダウンタイムを最小限に抑えること及び基板のパーティクル汚染を最小限に抑える基板処理ツールを提供する。【解決手段】基板処理ツール６９０は、搬送チャンバ６２５に１つのユニットとして結合可能なモジュール式ユニットを形成するフレームと、モジュール式ユニット内に形成された積み重なった封止可能なチャンバと、積み重なった封止可能なチャンバの各々に個別に接続された共通流体搬送マニホールドと、を含む。共通流体搬送マニホールドは、積み重なった封止可能なチャンバの各々に個別に接続するための個別の接続インタフェースを有する。個別の接続インタフェースは、個別の接続インタフェースが積み重なった封止可能なチャンバの各々との接続に関して互いに交換可能なように共通の配置を有する。【選択図】図２
Bibliography:Application Number: JP20200183300