BOARD PROCESSING APPARATUS, BOARD PROCESSING SYSTEM, AND METHOD OF PROCESSING BOARD

• Main Authors: MURAMOTO RYO, NAKAI HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 18.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technique that can appropriately hold a board one by one to perform processing on the board even when a plurality of boards with different warpage states is sequentially transferred.SOLUTION: A board processing apparatus 1 includes a board holding part 2, a chuck drive mechanism 25, and a processing liquid supply part 4. The board holding part 2 has a plurality of first chuck pins 231a that holds a circumference of a first-type board, and a plurality of second chuck pins 231b that holds a circumference of a second-type board. The second-type board is a warpage board more warped than a first-type board. Each of the first chuck pins 231a has a first v-shaped contact surface that sandwiches the circumference of the board in a vertical direction. Each of second shuck pins 231b has a second v-shaped contact surface that sandwiches the circumference of the board in the vertical direction. An upper edge of the second contract surface is higher than an upper edge of the first contact surface, and an upper edge of the second chuck pin 231b is higher than an upper edge of the first chunk pin 231a.SELECTED DRAWING: Figure 5 【課題】反り状態の異なる複数の基板が順次に搬送されても、当該基板を一枚ずつ適切に保持して当該基板に対して処理を行うことができる技術を提供する。【解決手段】基板処理装置１は基板保持部２とチャック駆動機構２５と処理液供給部４とを備える。基板保持部２は、第１種類の基板の周縁を保持する複数の第１チャックピン２３１ａと、第２種類の基板の周縁を保持する複数の第２チャックピン２３１ｂとを含む。第２種類の基板は、第１種類の基板よりも反っている反り基板である。第１チャックピン２３１ａの各々は、基板の周縁を鉛直方向に挟むＶ字状の第１当接面を有する。第２チャックピン２３１ｂの各々は、基板の周縁を鉛直方向に挟むＶ字状の第２当接面を有する。第２当接面の上端は第１当接面の上端よりも高く、第２チャックピン２３１ｂの上端は第１チャックピン２３１ａの上端よりも高い。【選択図】図５