METHOD FOR PRODUCING WIRING BOARD, AND SUBSTRATE FOR FORMING WIRING BOARD, INTERMEDIATE PRODUCT OF WIRING BOARD, AND WIRING BOARD AND WIRING BOARD WITH ELEMENT

• Main Authors: CHIGIRA ATSUKO, MAWATARI HIROSHI, SASAO KEITA, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 18.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a method of producing a wiring board in which a side conductor does not cause a defect of communication between front and rear surfaces of the board even when the side conductor is manufactured by a dry process.SOLUTION: Seed layers 5 (conductive layers) are formed by a dry process on both sides of a disconnected substrate 11 having a through hole H with a shape in which one of its two orthogonal axes each other is larger than the other. A resist patterns 6 are formed on regions except a land formation region and an in-plane wiring formation region. Plating layers are formed on the seed layers 5 exposed from the resist patterns 6. By removing the resist patterns 6 and the seed layers 5 immediately below the resist pattern, a side conductor, a land portion 3, and an in-plate wiring 4 are formed. By cutting the disconnected substrate 11 at a cutting plane which disconnects the thorough hole H, a wiring board 10 in which the side conductor, the land portion 3, and the in-plate wiring 4 is formed is produced.SELECTED DRAWING: Figure 1 【課題】ドライプロセスで側面導体を製造した場合であっても、基板の表裏面における導通に問題が生じることの無い側面導体とすることができる配線基板の製造方法を提供する。【解決手段】直交する２軸のうち一方の軸が他方の軸よりも長い形状を有する貫通孔Ｈが配置された被切断基板１１の両面に、ドライプロセスによりシード層（導電層５）を形成する。ランド部形成領域および面内配線形成領域を除いた領域に、レジストパターン６を形成する。レジストパターン６から露出しているシード層５にめっき層を形成する。レジストパターン６及びレジストパターン直下のシード層５を除去することにより、側面導体、ランド部３、および面内配線４を形成する。貫通孔Ｈを分断する切断面で被切断基板１１を切断することで、側面導体、ランド部３および面内配線４が形成された配線基板１０を製造する。【選択図】図１