HERMETIC TERMINAL

• Main Authors: TANAKA MAKOTO, MORIKAWA TETSUSHI, KATO HIROSHI, OKUNO AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 18.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; SEMICONDUCTOR DEVICES

To provide a hermetic terminal that satisfies all of high heat dissipation, large current and high airtightness.SOLUTION: A hermetic terminal comprises: a metal outer ring 12 of a low-resistance conductor comprising copper or a copper alloy having at least one through-hole 11; a lead 13 of a low-resistance conductor comprising copper or a copper alloy inserted through the through-hole 11 of the metal outer ring 12; and an insulating material 14 of high-expansion glass hermetically bonding the metal outer ring 12 and the lead 13 together. The insulating material 14 has diffusion zones 15 of copper ions in the glass in transition regions at interfaces in contact with the metal outer ring 12 and the lead 13. The high-expansion glass that can used herein has a thermal expansion coefficient in the range of 17±6 ppm/K.SELECTED DRAWING: Figure 1 【課題】高放熱、大電流、高気密の全てに適合した気密端子を提供する。【解決手段】少なくとも１個の貫通孔１１を有した銅または銅合金からなる低抵抗導体の金属外環１２と、この金属外環１２の貫通孔１１に挿通した銅または銅合金からなる低抵抗導体のリード１３と、金属外環１２とリード１３とを封着する高膨張ガラスの絶縁材１４を備えたことを特徴とする。該絶縁材１４は、金属外環１２とリード１３とに接した界面の遷移領域のガラス中に銅イオンの拡散帯１５を有する。高膨張ガラスは、熱膨張係数１７±６ｐｐｍ／Ｋの範囲のものが利用できる。【選択図】図１