SYSTEM AND METHOD FOR ANALYZING SEMICONDUCTOR DEVICE

To provide a system and method for analyzing a semiconductor device capable of accurately detecting various defects.SOLUTION: A system for analyzing a semiconductor device comprises: an entire-surface etching module for etching an entire surface of a wafer at the same etch rate to a depth where an o...

Full description

Saved in:
Bibliographic Details
Main Authors MA SEONG MIN, LEE BYONG HO, HAN JIN HEE, LEE JUNG MIN, LEE CHANG HWAN
Format Patent
LanguageEnglish
Japanese
Published 15.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online AccessGet full text

Cover

More Information
Summary:To provide a system and method for analyzing a semiconductor device capable of accurately detecting various defects.SOLUTION: A system for analyzing a semiconductor device comprises: an entire-surface etching module for etching an entire surface of a wafer at the same etch rate to a depth where an object to be analyzed exists; an analyzing module for obtaining two-dimensional structure analysis information from the etched surface of the wafer; and a computing apparatus for stacking and processing, in time series, the two-dimensional information obtained by the analyzing module so as to reconstruct a three-dimensional image.SELECTED DRAWING: Figure 1 【課題】本発明は、多様な不良が正確に検出できる半導体素子の分析システム及び方法を提供する。【解決手段】本実施例に係る半導体素子の分析システムは、分析対象が存在する深さまで、ウェーハの表面の全面を同一のエッチング速度でエッチングする全面エッチングモジュール；エッチングされた前記ウェーハの表面から２次元構造分析情報を取得する分析モジュール；及び、前記分析モジュールで獲得した前記２次元情報を時系列的に積層及び処理して３次元イメージを再構成するコンピュータ装置を含む。【選択図】図１
Bibliography:Application Number: JP20190224666