WIRING BOARD WITH SUPPORT BOARD, WIRING BOARD, WIRING BOARD LAMINATE WITH ELEMENT, AND WIRING BOARD WITH ELEMENT

• Main Authors: CHIGIRA ATSUKO, MAWATARI HIROSHI, SASAO KEITA, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a wiring board having a coreless structure in which no problem occurs even when an electrode layer on the surface on the support board side is subjected to post-treatment such as gold plating, and the surface on the support board side has good smoothness.SOLUTION: In a wiring board 10 with a support board, a wiring board 2 is used as the wiring board 2 peeled off from a support board 1 and having a coreless structure. An electrode layer 21 has a first electrode layer 21a arranged at a position closest to the support board 1. An insulating layer 22 has a first insulating layer 22a arranged at a position closest to the support board 1 and arranged on the side surface of the first electrode layer 21a. An adhesion layer 23 is arranged at least in a support board side region between the side surface of the first electrode layer 21a and the first insulating layer 22a.SELECTED DRAWING: Figure 1 【課題】支持基板側であった面の電極層に金メッキ等の後処理を施した場合でも不具合が生じず、かつ支持基板側であった面の平滑性が良好なコアレス構造を有する配線基板を提供する。【解決手段】支持基板付配線基板１０において、配線基板２は、支持基板１から剥離されてコアレス構造を有する配線基板２として用いられる。電極層２１は、支持基板１に最も近い位置に配置された第１電極層２１ａを有する。絶縁層２２は、支持基板１に最も近い位置に配置され、かつ、第１電極層２１ａの側面に配置された第１絶縁層２２ａを有する。第１電極層２１ａの側面と、第１絶縁層２２ａとの間の、少なくとも支持基板側領域に、密着層２３が配置されている。【選択図】図１