BONDING METHOD, BONDING DEVICE AND JIG USED IN BONDING DEVICE

• Main Authors: SATO TOYOKI, TERAYAMA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2021
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To provide a method of bonding objects to each other without causing voids being mixed into a product, without decreasing reliability of the product, and without deteriorating a yield during manufacture.SOLUTION: A bonding method according to the present invention is a bonding method in which a firs...