BONDING METHOD, BONDING DEVICE AND JIG USED IN BONDING DEVICE

• Main Authors: SATO TOYOKI, TERAYAMA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2021
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To provide a method of bonding objects to each other without causing voids being mixed into a product, without decreasing reliability of the product, and without deteriorating a yield during manufacture.SOLUTION: A bonding method according to the present invention is a bonding method in which a first main surface of a first object and a second main surface of a second object are bonded through a bonding layer. The method comprises: a forming step of the bonding layer on the second main surface, and a mounting step to mount the first object and the second object in a chamber in a state in which the bonding layer and the first main surface are separated; an exhausting step to exhaust an inside of the chamber to reduce pressure; a contacting step in which the bonding layer and the first main surface are brought into contact with each other in the reduced chamber; and an atmosphere introducing step to introduce the atmosphere into the chamber.SELECTED DRAWING: Figure 9 【課題】製品にボイドが混入することはなくなり、製品の信頼性を低下させたり、製造時の歩留まりを悪化させたりすることがない対象物同士の接合方法を提供する。【解決手段】本発明に係る接合方法は、第１対象物の第１主面と、第２対象物の第２主面とを、接合層を介して、接合させる接合方法であって、前記第２主面に前記接合層を形成すると共に、前記接合層と前記第１主面とを離隔させた状態で、前記第１対象物と前記第２対象物とをチャンバー内に載置する載置工程と、前記チャンバー内を排気して減圧状態とする排気工程と、減圧状態とされた前記チャンバー内で前記接合層と前記第１主面とを当接させる当接工程と、前記チャンバー内に大気を導入する大気導入工程と、を有することを特徴とする。【選択図】 図９