ELECTRONIC DEVICE

To provide an electronic device capable of suppressing corrosion.SOLUTION: An electronic device includes a metal member 211, a bonding target member 212, a metal bonding layer 213, and a rust preventive film 217. The bonding target member 212 is arranged on a lower surface 211a side of the metal mem...

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Bibliographic Details
Main Author MIYAKE TOSHIHIRO
Format Patent
LanguageEnglish
Japanese
Published 12.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide an electronic device capable of suppressing corrosion.SOLUTION: An electronic device includes a metal member 211, a bonding target member 212, a metal bonding layer 213, and a rust preventive film 217. The bonding target member 212 is arranged on a lower surface 211a side of the metal member 211, and has an upper surface 212a facing the entire area of the lower surface 211a. The metal bonding layer 213 includes at least metal films 213a and 213b made of gold or a gold alloy, and bonds the lower surface 211a of the metal member 211 and the upper surface 212a of the bonding target member 212. In a region where the metal member 211 and the bonding target member 212 face each other, the thickness of the metal bonding layer 213 is smaller than the flatness of the lower surface 211a and the upper surface 212a. The rust preventive film 217 is provided at a portion of a predetermined range from the boundary between the side surface 211b and the metal bonding layer 213 on the side surface 211b continuous with at least the lower surface 211a of the metal member 211.SELECTED DRAWING: Figure 2 【課題】腐食を抑制できる電子装置を提供すること。【解決手段】電子装置は、金属部材２１１、被接合部材２１２、金属接合層２１３、および防錆膜２１７を備える。被接合部材２１２は、金属部材２１１の下面２１１ａ側に配置され、下面２１１ａの全域と対向する上面２１２ａを有する。金属接合層２１３は、金または金合金を材料とする金属膜２１３ａ，２１３ｂを少なくとも含み、金属部材２１１の下面２１１ａと被接合部材２１２の上面２１２ａとを接合する。金属部材２１１と被接合部材２１２との対向領域において、金属接合層２１３の厚みは、下面２１１ａおよび上面２１２ａの平面度よりも小さい。防錆膜２１７は、少なくとも金属部材２１１の下面２１１ａに連なる側面２１１ｂにおいて、金属接合層２１３との境界から所定範囲の部分に設けられている。【選択図】図２
Bibliography:Application Number: JP20190128739