THERMOSETTING RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: KANEKO TATSUNORI, KAKIYA MINORU, SHIRAOKAWA YOSHIKATSU, KUSHIDA KEISUKE
• Format: Patent
• Language: English; Japanese
• Published: 04.02.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a thermosetting resin composition excellent in dielectric characteristics and laser processability, to provide a prepreg using the thermosetting resin composition, to provide a copper-clad laminate, to provide a printed wiring board and to provide a semiconductor package.SOLUTION: A thermosetting resin composition contains: (A) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from maleic anhydride; (B) an epoxy-modified polybutadiene; (C) an active ester compound; (D) one or more kinds selected from a group consisting of a maleimide compound and a modification product thereof; and (E) an epoxy resin including an alicyclic skeleton. A prepreg using the thermosetting resin composition, a copper-clad laminate, a printed wiring board and a semiconductor package are provided.SELECTED DRAWING: None 【課題】誘電特性及びレーザー加工性に優れる熱硬化性樹脂組成物、並びに該熱硬化性樹脂組成物を用いたプリプレグ、銅張積層板、プリント配線板及び半導体パッケージを提供する。【解決手段】（Ａ）芳香族ビニル化合物に由来する構造単位と無水マレイン酸に由来する構造単位とを有する共重合樹脂と、（Ｂ）エポキシ変性ポリブタジエンと、（Ｃ）活性エステル化合物と、（Ｄ）マレイミド化合物及びその変性物からなる群から選ばれる１種以上と、（Ｅ）脂環式骨格を含むエポキシ樹脂と、を含有してなる熱硬化性樹脂組成物、並びに該熱硬化性樹脂組成物を用いたプリプレグ、銅張積層板、プリント配線板及び半導体パッケージである。【選択図】なし