TOOL HEIGHT ADJUSTMENT DEVICE AND CHIP COMPONENT TRANSFER DEVICE INCLUDING THE SAME

• Main Authors: TERADA KATSUMI, MATSUMOTO TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 28.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a chip component transfer device capable of reliably picking up a chip component even with a pickup tool using a flexible member having a small pressure change due to contact with a chip holding portion.SOLUTION: In a chip component transfer device, a tool height adjustment device 1 includes a transfer source stage 3 that holds a transfer source substrate, a pickup tool 2 that has a chip holding portion 21 that holds a chip component using a flexible member and picks up the chip component on the transfer source substrate, and control means 10 that controls the vertical drive of the pickup tool 2, and adjusts the height position of the chip holding portion 21. A flexible member of the chip holding portion 21 is compressed, the pickup tool 2 is lowered to a state in which the chip holding portion 21 effectively holds the chip component, and then the pickup tool 2 is raised.SELECTED DRAWING: Figure 1 【課題】チップ保持部に接触に伴う圧力変化が小さい柔軟部材を用いたピックアップツールでも、チップ部品を確実にピックアップすることが可能なチップ部品転写装置を提供する。【解決手段】チップ部品転写装置において、ツール高さ調整装置１は、転写元基板を保持する転写元ステージ３と、柔軟部材を用いてチップ部品を保持するチップ保持部２１を有し、転写元基板上のチップ部品をピックアップするピックアップツール２と、ピックアップツール２の上下駆動を制御する制御手段１０を有し、チップ保持部２１の高さ位置を調整する。チップ保持部２１の柔軟部材を圧縮させ、チップ保持部２１がチップ部品を有効に保持する状態までピックアップツール２を降下させてから、ピックアップツール２を上昇させる。【選択図】図１